W25Q64FV
6.2.35
Read SFDP Register (5Ah)
The W25Q64FV features a 256-Byte Serial Flash Discoverable Parameter (SFDP) register that contains
information about device configurations, available instructions and other features. The SFDP parameters
are stored in one or more Parameter Identification (PID) tables. Currently only one PID table is specified,
but more may be added in the future. The Read SFDP Register instruction is compatible with the SFDP
standard initially established in 2010 for PC and other applications, as well as the JEDEC standard
JESD216 that is published in 2011. Most Winbond SpiFlash Memories shipped after June 2011 (date
code 1124 and beyond) support the SFDP feature as specified in the applicable datasheet.
The Read SFDP instruction is initiated by driving the /CS pin low and shifting the instru ction code “5Ah”
followed by a 24-bit address (A23-A0) (1) into the DI pin. Eight “dummy” clocks are also required before the
SFDP register contents are shifted out on the falling edge of the 40 th CLK with most significant bit (MSB)
first as shown in Figure 34. For SFDP register values and descriptions, please refer to the Winbond
Application Note for SFDP Definition table.
Note: 1. A23-A8 = 0; A7-A0 are used to define the starting byte address for the 256-Byte SFDP Register.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
CLK
Mode 0
Instruction (5Ah)
24-Bit Address
DI
(IO 0 )
23
*
22
21
3
2
1
0
DO
(IO 1 )
/CS
High Impedance
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
CLK
Dummy Byte
DI
(IO 0 )
0
7
6
5
4
3
2
1
0
Data Out 1
Data Out 2
DO
(IO 1 )
*
= MSB
High Impedance
7
*
6
5
4
3
2
1
0
7
*
6
5
4
3
2
1
0
7
Figure 34. Read SFDP Register Instruction Sequence Diagram (SPI Mode only)
- 62 -
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W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
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W25Q64FVSSIG 功能描述:IC SPI FLASH 64MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q64FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64FVSSIG/TRAY 制造商:Winbond Electronics Corp 功能描述:
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W25Q64FVTCIG 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI
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